| Layer |
1~6 layer |
1-6 copper layers PCB (Don't support Blind/Buried Vias) |
| Surface Finish |
- Organic Solderability Preservative (OSP),
- Hot Air Solder Level (HASL),
- Lead-free HASL,
- Electrolytic Nickel/Gold - Ni/Au (Hard/Soft Gold),
- Electro less Nickel Immersion Gold (ENIG),
- Immersion Silver (IAg),
- Immersion Tin (ISn)
|
| Material |
FR-4, MCPCB (AL), CEM-1, CEM-3, High TG |
|
| Controlled Impedance PCB |
4 and 6 layer |
No extra charge. We only accept our default layer stack-up. |
| Solder Mask Colour |
Green, White, Black, Blue, Red, Yellow |
|
| Silk Screen Colour |
White, Black, Blue |
|
| Min. Character Width and Height |
Min character width: 4mil Min Character height: 27.5mil |
Characters width less than 4mil(0.153mm) will be unidentifiable. Characters height less than 32mil will be unidentifiable. |
| Max size |
1198mm x 350mm |
|
| SOLDER MASK |
LPI |
Liquid Photo-Imageable Solder Mask is the most common mask type. |
| Finished Outer Layer Copper |
1oz~3oz
(35um~105um) |
Max finished outer layer copper weight is 3oz |
| Finished Inner Layer Copper |
0.5oz(17um) |
Finished inner layer copper weight is 0.5 oz only. |
| Dimension Tolerance(Outline) |
+/- .15mm |
Dimension Tolerance (Outline) is 0.15mm |
| Thickness |
0.4~3.0mm |
0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0mm. We also deal in Flexible, Flex-Rigid PCB’s and High-frequency PCBs. |
| Thickness Tolerance ( T≥1.0mm) |
± 10% |
Eg. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%) |
| Thickness Tolerance ( T<1.0mm)(T<1.0mm) |
±0.1mm |
0.7mm（T-0.1）~0.9mm（T+0.1） |
| Min Dielectric Thickness |
0.6mm |
|
| Drill Hole Size |
0.25~6.3mm |
Min. drill size is 0.25mm, Max. Drill size is 6.3mm. |
| Drill Dimension Tolerance |
+/-0.075mm |
|
| Drill to Drill Clearance |
0.2mm |
|
| Drill to Copper |
0.15mm |
|
| NPTH to Copper Clearance |
MIN 0.25mm |
|
| Hole Size Tolerance |
+/- 0.08mm |
Eg. For the 0.6mm hole, the finished hole size between 0.52mm to 0.68mm is acceptable. |
| Min. Trace |
3.5mil |
For Single & Double Layer PCB, the minimum trace width is 5mil; For Multi-Layer PCB, the minimum trace width is 3.5mil. |
| Min. Spacing |
4mil |
For Single & Double Layer PCB, the minimum spacing is 5mil; For Multi-Layer PCB, the minimum spacing is 4mil. |
| Min. Via diameter |
Min Inner Diameter (hole):0.25mm,Min Outer diameter :0.5mm |
For multilayer PCB: Min Inner Diameter (hole):0.25mm,Min Outer diameter :0.5mm For double layer PCB: Min inner diameter:0.3MM, Min outer diameter :0.6MM |
| Pad to trace |
6mil |
Minimum distance between and trace is 6mil |
| Annular Ring |
5mil |
Annular Ring>5mil |
| Trace to Outline(Ship as individual board with Routing) |
≥0.2mm |
Ship as individual board(Routing): Trace to Outline ≥0.2mm; Ship as panel with V-scoring: Trace to V-cut line ≥0.4mm |
| Trace to Outline(Ship as panel with V-scoring) |
≥0.4mm |
Ship as panel with V-scoring: Trace to V-cut line ≥0.4mm |
| Min Strip |
3mm |
Ship as individual board(Routing):Trace to Outline ≥0.2mm; Ship as panel with V-scoring; Trace to V-cut line ≥0.4mm |
| Panel without space |
0mm |
The distance between each pc is 0MM |
| Panel with space |
1.6mm |
Make sure the space between boards should be ≥1.6mm; otherwise it will be hard to process for routing. |
| Min. Half Hole Diameter |
0.8mm |
Half hole is a special technology, so half hole diameter should be bigger than 0.6mm. |
| Solder mask opening |
0.05mm |
If need solder mask bridge, it should be more than 4MIL |